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Thermal Management

Techniques and technologies for removing heat from systems through methods like convection, conduction and others.

Featured Article

AMCC Becomes AppliedMicro—with the Focus on Low-Power Processing

Electricity—we’re using more of it and it’s costing more. And so much of it that we use is wasted, simply dissipated as heat, which requires even more electricity in the form ofRead More...

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Thermal Management for the Small Box

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Thermal Management of High Power in Small Spaces: Myths and Misconceptions Challenged

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Conduction-Cooled ATR 6U VPX Platform Provides High Thermal Performance

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Quad-Core Blade Server in New CoolShell Package

Quad-Core Blade Server in New CoolShell Package   The principle barrier to higher compute density in modular electronic packaging is the cooling and mechanical stabilization ofRead More...

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Low Profile Heat Sinks Cool Hot Components in Constricted Packages

A line of lower height heat sinks is designed for cooling ICs and other hot components in narrow packaging and low airflow velocity conditions. The maxiFLOW heat sinks from AdvancedRead More...

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If You Cant Take the Heat... Get out of the Stack

In spite of the new ultra-low-power silicon on the market, it’s tempting to bite off more than you can cool. If you ‘duo’ (do), you can blow your diet threefold—first, you can killRead More...

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MMC Management Solution Using ACTEL SmartFusion

A new module management controller (MMC) board management reference (BMR) starter kit is based on Actel’s SmartFusion intelligent mixed signal programmable/configurable applicationRead More...

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Shelf Manager Support for PICMG HPM.2 AND HPM.3

A new release of the Pigeon Point Shelf Manager adds support for the PICMG HPM.2 and HPM.3 specifications, complementing corresponding support in the Pigeon Point Board ManagementRead More...

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CPU Cooler Improves Airflow, Water Block and Heat Dissipation Capacity

A CPU cooler is designed to provide an extremely efficient cooling solution for CPUs from Intel and AMD. The Hydro Series H70CPU cooler from Corsair is an evolution of the Hydro SeriesRead More...

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Updates to xTCA Management Controller Solutions for Smartfusion

Pigeon Point Systems has announced the release of significant enhancements to its xTCA management controllers solutions based on the Microsemi SmartFusion intelligent mixed signalRead More...

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EPIC-Express Board Demonstrates New Cooling Concept and Mechanical Design

EPIC-Express Board Demonstrates New Cooling Concept and Mechanical Design A new product family targets strategic mission-critical systems and enables easy andRead More...

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3U VPX Air Baffle Board

A new VPX air blocker board in the 3U height is designed to fill in unused slots and redirect (or contain) airflow. VPX systems can require high levels of heat dissipation. The airRead More...

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Small, Flexible Candlestick Sensor Measures Temperature and Air Velocity

A flexible, robust candlestick sensor can simultaneously measure both temperature and air velocity for characterizing thermal conditions in electronic systems. The MS 1000-CS-WC fromRead More...

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Thermal Analysis and Heat Sink Design Optimize Cooling of High-Performance Modules

A leading provider of embedded computing solutions needed to determine the thermal characteristics of its new packet processor. Such devices often entail complex heat transfer andRead More...

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Rugged, Liquid Cooled ATR Chassis Accepts 6U VPX Boards

A new rugged 1 ATR tall, short enclosure with independent dual liquid cooled side walls offers significantly better cooling than conduction only and air-flow designs. Targeted forRead More...

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Conduction Keeps Computing Cool

Reliable. Quiet. Affordable. Small. With protection from dust and humidity, and flexible mounting options. And easy on the electric bill. System designers expect everything fromRead More...

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Smart Cooling Pipes Pave the Way for Performance Growth in COM Express

A new cooling system for the COM Express specification is based on cooling pipes, which are integrated in the standardized heat spreader. Introduced by congatec, this solution makes itRead More...

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Fourth Generation ATCA Shelf Management Solution

A new fourth generation Shelf Management Mezzanine (ShMM) product has been tested in customer shelves for many months, and multiple customer-specific Shelf Manager boards are now inRead More...

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Surface Thermography Liquid Crystals Reveal Hot Spots in Electronic Devices

A new kit for identifying hot spots in electronic devices features spray-on thermochromic liquid crystals that change color at different temperatures to reveal heat issues on chips andRead More...

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Too Hot to Handle

Engineers everywhere are trying to beat the heat this summer. Some have contracts to fulfill, held up only by the thermal design and qualification. The 45 watt 2 GHz+ quad coreRead More...

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Getting the Heat Out of Ever Smaller Systems

Demand for performance in computer systems continues to grow, and the embedded systems used in mobile or exposed applications are no exception. What is exceptional in theseRead More...

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New Stamped CPU Heat Sink Improves Air Convection

A newly developed Stamped CPU Heat Sink series from Assman WSW is a combination of “CROSS-CUT” and “Finger-Shaped heat sinks.” The series is available at distributor Rutronik as ofRead More...