DIGITAL EDITION
INDUSTRY NEWS
- When Heat Is On, Thermal Characterization Keeps Things Cool
- Cavium, Freescale Roll Embedded Processors
- Fixing Concurrency Defects In Multicore Design
- Stm32 Microcontroller Design Challenge – Stmicroelectronics
- Wafer Area Shipments Up 136% In Q1
WHITEPAPERS
- Why Choose an Embedded System for Your Next Application
- High-Speed, Real-Time Recording Systems Handbook
- Software Defined Radio Handbook
- Simplifying M2M
- A Comparison of OpenVPX System Bandwidth between Serial RapidIO and 10 Gigabit Ethernet
- A Comparison of MPEG4 (H.264) and JPEG2000 Video Compression and Decompression Algorithms
- Choosing an RTOS for Remote-care Medical Devices
- BDTi's Analysis of Altera's Floating-point DSP Design Flow
- Finding Concurrency Errors with Static Analysis
- Stackable Modules Enable High-Performance, Pilot Worn Tactical Display
QUICK DOWNLOADS
RTEC10 is an index made up of 10 public companies which have revenue that is derived primarily from sales in the embedded sector. The companies are made up of both software and hardware companies being traded on public exchanges.
| COMPANY | PRICE (USD) | CHANGE |
|---|---|---|
 Adlink | 1.36 | -1.350%
|
 Advantech | 3.12 | 0.109%
|
| Concurrent Comp | 3.70 | -2.375%
|
| - Elma | 477.25 | 0.000% |
| Enea | 6.35 | 7.949%
|
| Interphase | 5.28 | 2.326%
|
| Kontron | 8.12 | 0.246%
|
| Mercury Comp | 14.62 | 0.412%
|
| Performance Tech | 1.94 | -2.513%
|
| - PLX | 0.00 | |
| Radisys | 7.40 | 0.271%
|
| 52 WK HIGH | 52 WK LOW | MKT CAP (Million USD) |
|---|---|---|
1.38 | 1.36 | 187.35 |
3.12 | 3.08 | 1,720.94 |
3.84 | 3.70 | 34.05 |
| 477.25 | 477.25 | 109.05 |
6.52 | 6.23 | 112.19 |
5.28 | 5.12 | 36.41 |
8.16 | 8.03 | 452.11 |
14.69 | 14.49 | 451.15 |
2.04 | 1.94 | 21.57 |
| 0.00 | 0.00 | 0.00 |
7.50 | 7.30 | 205.25 |
Thermal Management
Techniques and technologies for removing heat from systems through methods like convection, conduction and others.
AMCC Becomes AppliedMicro—with the Focus on Low-Power Processing
Electricity—we’re using more of it and it’s costing more. And so much of it that we use is wasted, simply dissipated as heat, which requires even more electricity in the form ofRead More...
Air and Conduction Cooling for 3U COTS Cards: An Overview
There are many trends at the die level and circuit card level that can drive the decision of which cooling method to use for 3U COTS cards in rugged applications. One of these trendsRead More...
Quad-Core Blade Server in New CoolShell Package
Quad-Core Blade Server in New CoolShell Package The principle barrier to higher compute density in modular electronic packaging is the cooling and mechanical stabilization ofRead More...
Low Profile Heat Sinks Cool Hot Components in Constricted Packages
A line of lower height heat sinks is designed for cooling ICs and other hot components in narrow packaging and low airflow velocity conditions. The maxiFLOW heat sinks from AdvancedRead More...
Thermal Analysis and Heat Sink Design Optimize Cooling of High-Performance Modules
A leading provider of embedded computing solutions needed to determine the thermal characteristics of its new packet processor. Such devices often entail complex heat transfer andRead More...
If You Cant Take the Heat... Get out of the Stack
In spite of the new ultra-low-power silicon on the market, it’s tempting to bite off more than you can cool. If you ‘duo’ (do), you can blow your diet threefold—first, you can killRead More...
EPIC-Express Board Demonstrates New Cooling Concept and Mechanical Design
EPIC-Express Board Demonstrates New Cooling Concept and Mechanical Design A new product family targets strategic mission-critical systems and enables easy andRead More...
MMC Management Solution Using ACTEL SmartFusion
A new module management controller (MMC) board management reference (BMR) starter kit is based on Actel’s SmartFusion intelligent mixed signal programmable/configurable applicationRead More...
Thermal Management and Power Integrity in Tight Spaces
The advent of programmable logic devices (PLDs) increased circuit component miniaturization and increasing circuit densities on PCBs have introduced an exponential increase in powerRead More...
CPU Cooler Improves Airflow, Water Block and Heat Dissipation Capacity
A CPU cooler is designed to provide an extremely efficient cooling solution for CPUs from Intel and AMD. The Hydro Series H70CPU cooler from Corsair is an evolution of the Hydro SeriesRead More...
3U VPX Air Baffle Board
A new VPX air blocker board in the 3U height is designed to fill in unused slots and redirect (or contain) airflow. VPX systems can require high levels of heat dissipation. The airRead More...
Compression-Based A-to-D Converters: Reaching New Low Power Limits in Quantization
In traditional analog-to-digital conversion, the signal is “blindly” converted without any consideration to the signal type or statistics. As a result, the conversion process wastes aRead More...
Mandates for Power Efficiency Push Telcom Providers Toward Software Optimization
Power efficiency has emerged as one of the key areas for long-term improvement in telecom applications. Reduced energy usage means lower costs and diminished environmental impact. InRead More...
A New Approach to 3U VPX Pre-Configured Conduction Cooled Systems
Size, weight and power (SWaP) requirements have dramatically changed the embedded military and aerospace system landscape. As VPX systems mature, the size and modularity of the 3U formRead More...
Updates to xTCA Management Controller Solutions for Smartfusion
Pigeon Point Systems has announced the release of significant enhancements to its xTCA management controllers solutions based on the Microsemi SmartFusion intelligent mixed signalRead More...
Energy Harvesting Applications are Everywhere
The concept of energy harvesting has been around for over a decade; however, the implementation of ambient energy-powered systems in the real-world environment has been cumbersome,Read More...
Small, Flexible Candlestick Sensor Measures Temperature and Air Velocity
A flexible, robust candlestick sensor can simultaneously measure both temperature and air velocity for characterizing thermal conditions in electronic systems. The MS 1000-CS-WC fromRead More...
Conduction Keeps Computing Cool
Reliable. Quiet. Affordable. Small. With protection from dust and humidity, and flexible mounting options. And easy on the electric bill. System designers expect everything fromRead More...
Rugged, Liquid Cooled ATR Chassis Accepts 6U VPX Boards
A new rugged 1 ATR tall, short enclosure with independent dual liquid cooled side walls offers significantly better cooling than conduction only and air-flow designs. Targeted forRead More...