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COM
A computer-on-module (COM) is a type of single-board computer (SBC), a subtype of an embedded computer system. It is also called System on Module (SOM) as an extension of the concept of System on Chip (SoC) and lying between a full-up computer and a microcontroller in nature.
COMs vs. SBCs: Forward Thinking Helps Make the Best Embedded Choices
The end application of any design typically helps define the choice of the computing form factor used. From there, the desired level of performance and scalability can be built intoRead More...
Products & Technologies
NEMA 16-Channel Optically Isolated Input / Relay Output Modules Require No PC A pair of intelligent 16-channel wireless digital I/O units communicate directly with each other. EachRead More...
LPC Bus-Legacy Lives On
Legacy buses and I/O appear to be on the chopping block. Large pin count parallel communications buses are being replaced by faster serial architectures. Examples include Serial ATARead More...
Confused or Liberated? Take Your Pick
Walking the floor of the recent Embedded World show in Nuremberg, Germany, one was immediately struck by the vast number of small form factor computer modules on display. The advent ofRead More...
Products & Technology
CSP/BallNest Hybrid Socket for Reliable Test and Burn-in to 0.30mm Pitch A new patented CSP/BallNest hybrid socket is suitable for prototyping, test or burn-in of CSP (chipRead More...
Small but Mighty: Small Form Factors Gaining Ground
Application-specific technology and expertise are critical to any embedded design. Advantages such as 45nm technology are pervasive and long-term, impacting embedded architecturesRead More...
Interoperability Scores a Victory with Plug and Play COM Spec
Computer-on-module (COM) manufacturers are delighted that their pluggable module alternatives to conventional single board computers (SBCs) are getting attention beyond the high-volumeRead More...
Interconnect Wars? Let Peace Prevail with Interconnect Standards
Size, cost, performance, application software development and debugging tools, wired or wireless networking, power budget, time-to-market, temperature range, expansion flexibility,Read More...
New Impulse for Embedded Computer Modules
Since the appearance of the first Computer-on-Module (COM) definition in 1999, the technology has found its way into almost all embedded computer applications. Following theRead More...
Toward a Unified Framework for Embedded Modules
In April of 2008, the Small Form Factor Special Interest Group (SFF-SIG) unveiled a new modular standard for stackable expansion of single board computers. The SFF-SIG’s new standard,Read More...
COM Express Module Sports Higher Graphics Performance
COM Express Module Sports Higher Graphics Performance A new high-performance COM Express compact module features the Intel GS45 small form factor (SFF) chipset, which enablesRead More...
Products & Technology
Extreme Rugged Methodology Comes to Mid-Range ETX As part of an initiative to extend its Extreme Rugged product lines, Adlink Technology has announced the first new Ampro byRead More...
Small Form Factor Special Interest Group Pushes Ambitious Standards Effort
The embedded board industry has recently experienced a rapid proliferation of standards for small form factor single board computers, I/O expansion modules and Computer-on-ModuleRead More...
“Compact” COM Express Module with Atom N270 and 945GSE Express Chipset
A “Compact” COM Express module measuring 95 mm x 95 mm is fully compatible with the Type 2 pin-out of the PICMG COM Express specification. This highly integrated Express-ATC “Compact”Read More...
Eurotech—from Sensors to Supercomputers
What kind of embedded computing company also produces Petascale supercomputers—computers running at over 1,000 Teraflops—and considers them integral to their embedded business? TheRead More...
Ruggedized Atom-Based COM Express Module
A low-power, long-lifecycle computer-on-module (COM) is based on the cost-effective, ultra-low-power Intel Atom N270. The Ampro by Adlink Express-ATR is specifically designed from theRead More...
Tiny Atom SBC Targets Power-over-Ethernet Apps
OEMs who build the tiniest, lowest-power devices tend to use RISC processors and microcontrollers at the heart of their systems. While the x86 architecture can reduce development costsRead More...
ETX 3.0 Module Combines Core 2 Duo Performance with Legacy I/O
A series of ETX 3.0-compliant computer-on-module (COM) products is based on Intel’s LV and ULV Core 2 Duo and Core Duo processors. The ETX-945 series modules from Diamond SystemsRead More...
COM Express Module with Intel Core 2 Duo Provides Flexible Configuration
A flexible COM Express design features the Intel CPU Socket 479, which enables support for Intel Core 2 Duo, Core Duo or single core Pentium M and Celeron M processors. The MB-80070Read More...
Embedded Form Factors Harness Emerging Technologies to Enable Wireless Systems
Wireless connectivity is merging with technological advancements in silicon, signaling, mass storage and software to meet the high-performance, ultra-low-power requirements forRead More...
SM and SUMIT-ISM Specs Bring SUMIT Expansion to 90 x 96 mm Stackable Modules
The Small Form Factor Special Interest Group (SFF-SIG) has announced the availability of both revision 1.0 of the Industry Standard Module (ISM) and the SUMIT-ISM specifications forRead More...
SUMIT-ISM—Uniting Legacy and Advanced I/O in a Stackable Form Factor
In early 2008, the Small Form Factor Special Interest Group (SFF-SIG) introduced a ground-breaking new interconnect technology called Stackable Unified Module Interconnect TechnologyRead More...
Compact Atom Solution for Extreme Environments
Compact Atom Solution for Extreme Environments A COM Express pin-out type-2-compatible computer-on-module is designed for use in extreme conditions. Each component in theRead More...
Have no Fear, Embedded World is Here!
The arrival of winter reminds us to make our annual pilgrimage to Nuremberg, Germany to witness the latest small form factor product introductions at the Embedded World show during theRead More...
COM Express Module Aimed at Graphics-Intensive Embedded Apps
A new Computer-on-Module (COM) is based on Intel’s Core2 Duo processor and GS45 chipset with Graphics Media Accelerator (GMA) 4500MHD, and is suited for power-sensitive applicationsRead More...
Core i7 / i5 COM Express Module Features Integrated Graphics and Memory Controller
A COM Express Type 2 module supports the 64-bit Intel Core i7 / i5 processor with CPU, memory controller and graphics processor on the same chip. Based on the latest Mobile IntelRead More...
COM Express Small Form Factor Module Based on Core i7
A new COM Express features the latest Intel Core i7-620M processor with a core speed of 2.66 GHz, with 4 Mbyte L2 cache and up to 8 Gbyte fast (1066 MT/s) dual channel DDR3 memory.Read More...