PCI Express Technology Features Low Power and New Form Factors for Mobile and IoT Advances PCI-SIG has expanded its technology’s low power capabilities with the introduction of L1 sub-states, Quarter-Swing technology, the M-PCIe specification, as [More…]
Having backplane performance levels available over a cable expands the PCIe usage model to encompass many high-end multi-chassis applications including I/O expansion, disk array subsystems, high-speed video and audio editing equipment, medical imaging systems, and many more. [More…]
The widespread success of PCI Express continues with the rollout of the 2.0 specification. The spec brings with it wider bandwidth for users and tighter design conditions for developers. [More…]
Taking PCI Express off the motherboard often involves dealing with a variety of legacy interconnects. A programmable solution can speed the process and adapt over time.
The PCI Express switched fabric interconnect technology has been widely adopted and is supported on a large number of board-level form-factors. Not all such form-factors support all variations of PCI Express. This overview is offered to help sort out the varieties.
FPGAs can provide fully integrated PCI Express solutions. However,
designers must look for the right combination of power, performance
and density to meet multilayer data path challenges. A set of selection
criteria can help them uncover the right solution. [More…]
PCI Express is showing up in an increasing number of systems and
applications. A few selected usage models can show how PCIe switches uniquely satisfy the application requirements and point the way for
further creative adoption.