Altera and Intel Extend Partnership to Include Development of Multi-Die Devices
Altera and Intel have announced their collaboration on the development of multi-die devices that leverage Intel’s package and assembly capabilities and Altera’s programmable logic technology. The collaboration is an extension of the foundry relationship between Altera and Intel, in which Intel is manufacturing Altera’s Stratix 10 FPGAs and SoCs using the 14nm Tri-Gate process.
Altera’s work with Intel will enable the development of multi-die devices that efficiently integrate monolithic 14nm Stratix 10 FPGAs and SoCs with other advanced components, which may include DRAM, SRAM, ASICs, processors and analog components, in a single package. The integration will be enabled through the use of high-performance heterogeneous multi-die interconnect technology. Altera’s heterogeneous multi-die devices provide the benefit of traditional 2.5 and 3D approaches with more favorable economic metrics. The devices will address the performance, memory bandwidth and thermal challenges impacting high-end applications in the communications, high-performance computing, broadcast and military segments.
Intel’s 14nm Tri-Gate process density advantage and Altera’s patented FPGA redundancy technology enable Altera to deliver the industry’s highest density monolithic FPGA die, offering greater integration of system components on a single die. Altera is leveraging its leadership in developing the largest monolithic FPGA die and Intel’s packaging technology to integrate even more capabilities into a single system-in-a-package solution. Intel’s manufacturing process is co-optimized to offer manufacturing simplicity consisting of turnkey foundry services that include the manufacturing, assembly and testing of heterogeneous multi-die devices. Intel and Altera are currently developing test vehicles aimed at streamlining manufacturing and integration flows.
Samsung and Green Hills Announce Certification for Government Networks
Samsung Electronics and Green Hills Software have announced that Samsung Knox Hypervisor has been approved for use on sensitive U.S. Department of Defense enterprise networks. The Authority to Operate (ATO), performed under the auspices of the U.S. Marine Corps, includes devices from the Samsung Galaxy line of smartphones and tablets and represents a broad collaboration between Green Hills Mobile, Samsung, mobile network carriers, systems integrators and the U.S. Department of Defense.
Samsung Knox Hypervisor is a foundational firmware layer of data protection and isolation below the mobile operating system, enabling a level of certifiable security that enhances application-level sandbox mechanisms. Whether devices are enterprise or personally owned, the Knox Hypervisor enables users to have complete confidence in the privacy of their photos, contacts, e-mail and other information while enterprise and government IT administrators manage the device’s business use with complete assurance in the security of enterprise information both within the device and across the enterprise network.
Samsung Knox offers several data protection and isolation solutions including Container and Hypervisor. Samsung Knox Hypervisor is a Type-1 mobile virtualization solution (also known as “Knox Integrity”) developed by Green Hills and integrated with the Knox mobile enterprise solutions suite. Shipping since 2003, the Integrity Hypervisor is built upon security-certified separation kernel technology that provides highly assured isolation between one or more “guest” operating systems (domains) while also providing a native open standard execution environment for security-critical tasks, including FIPS 140-2-certified and NSA Suite B-compliant data encryption, user authentication, security event auditing and remote management.
NVM Express SSD Work Group Incorporates
The NVM Express Work Group, developer of the NVM Express specification for accessing solid-state disks (SSDs) on a PCI Express (PCIe) bus, has announced its incorporation as the NVM Express Organization. The work group’s transition to an incorporated industry association indicates the member companies’ commitment to continue delivering technology and high-quality specifications that meet the needs of a rapidly changing storage market.
NVM Express is an optimized, high-performance, scalable host controller interface with a streamlined register interface and command set designed for enterprise and client systems that use PCI Express storage solutions. NVM Express reduces latency, providing faster performance, with support for security and end-to-end data protection. Version 1.0 of the specification was released in March 2011, and Version 1.1 was published in October 2012.
NVM Express is a standardized register interface, command and feature set for PCIe-based storage solutions, such as Solid-State Drives (SSDs) designed specifically for non-volatile memory. NVM Express is optimized for high performance and low latency, scaling from client to enterprise segments. The NVM Express Organization is currently developing revision 1.2 of the base specification, which adds new capabilities. In addition, the organization is also standardizing in-band and out-of-band management of PCI Express SSDs (e.g., LEDs, thermal control, etc.). These specifications are targeted for release in the second half of 2014.
The new organization will continue to be led by the current promoters: Cisco Systems, Dell, EMC, HGST, a Western Digital Co., Intel, LSI, Micron Technology, NetApp, Oracle, PMC-Sierra, Samsung, SanDisk and Seagate Technology.
Altera Joins IBM OpenPower Foundation to Enable FPGA-Based Power Solutions
Altera has announced it joined the IBM OpenPower Foundation, an open development alliance based on IBM’s Power microprocessor architecture. Altera will collaborate with IBM and other OpenPower Foundation members to develop high-performance compute solutions that integrate IBM Power CPUs with Altera’s FPGA-based acceleration technologies for use in next-generation data centers.
FPGAs provide Power users configurable hardware accelerators in the core compute complex that help system architects reduce operating expenses by achieving very high performance at lower power. IBM and Altera have already worked together to create a coherent interface between the Power8 processor and Altera’s Stratix V FPGAs. This collaboration provides developers a roadmap to use the high-performance capabilities of Altera’s Arria 10 and Stratix 10 FPGAs and SoCs in next-generation Power-based systems. Leveraging the Altera SDK for OpenCL, developers are able to integrate IBM Power CPUs with Altera FPGAs as a high-performance compute solution.
The OpenPower Foundation includes a group of companies working together to develop high-performance compute solutions based on the IBM Power architecture. OpenPower Foundation members include Altera, IBM, Google, Mellanox, NVIDIA, Samsung Electronics, Suzhou PowerCore Technology and Tyan. Together, the companies are building advanced server, networking, storage and hardware-acceleration technologies aimed at delivering more choices, control and flexibility to developers of next-generation hyperscale and Cloud data centers.
AMD and Mentor to Accelerate Open Source Linux Development for Embedded Systems
AMD has announced a multi-year agreement with Mentor Graphics to expand availability of open source embedded Linux development for heterogeneous and multicore processors from AMD. Dedicated to providing embedded developers with a more manageable and focused open source framework, the agreement will provide embedded developers with more supported processor options, robust development tools and greater speed in open platform development.
As a Yocto Project-compatible product, Mentor Embedded Linux will now bring standardized features and tools, and ensure quick access to the latest board support packages (BSPs) for AMD 64-bit x86 architecture beginning with the upcoming AMD Embedded G-Series system-on-a-chip (SoC) (code-named: “Steppe Eagle”) and AMD Embedded R-Series APU/CPU (code-named: “Bald Eagle”). Embedded systems developers will have comprehensive access to the Mentor Embedded Linux development platform for customized embedded Linux development and commercial support, as well as a no-cost Mentor Embedded Linux Lite derivative providing all the essentials to evaluate Linux on AMD embedded processors.
To address the growing complexity of embedded systems, embedded developers will also have access to Sourcery CodeBench for greater insight into system execution, performance and debugging applications in Linux-based embedded systems.
As part of the agreement between AMD and Mentor Graphics, embedded developers will have access to customized embedded Linux development products including the Yocto Project-compliant Mentor Embedded Linux Lite with free enablement for evaluation and prototyping for the upcoming AMD Steppe Eagle and Bald Eagle products. This will include binary images of root file system and kernel and access to sources for all open source components.
Also available will be Mentor Embedded Linux with commercial terms for project development including bug fixes, security patches and product updates, and the Eclipse-based Sourcery CodeBench development environment, data trace analysis and visualization capabilities. This also includes customizability for unique project needs including custom BSP development, back porting and long-term support.
Advantech to Partner with Linear Technology for Smart City and IoT Solutions
Advantech has announced that it is partnering with Linear Technology’s Dust Networks product group to develop Smart City and Internet of Things (IoT) solutions based on Dust’s SmartMesh IP embedded wireless sensor networks (WSN). Advantech will develop, manufacture and sell a variety of IoT gateways, wireless sensors and solutions that incorporate Linear’s industry-leading SmartMesh IP embedded WSN products as well as complementary power management and Power over Ethernet (PoE) ICs.
Advantech has declared 2014 as its first year for actual Smart City applications. The Internet of Things is growing rapidly and wireless sensor networks (WSNs) are essential for extending the reach of the Internet infrastructure to all kinds of devices. WSNs are already in use in critical monitoring and control applications worldwide. Linear Technology’s broad line of WSN products and high-performance analog and power integrated circuits are enabling products for industrial networks and the IoT. Linear Technology produces power management, data conversion, signal conditioning, RF and interface ICs, µModule subsystems and Dust Network’s SmartMesh wireless sensor network products.
Integrating Advantech RISC computing design power with Linear Technology’s Dust Networks WSN technology, Advantech Embedded Core Group will announce the release of a WSN controller, UBC-WN500, and sensor mote products, EWS-1540A and UBC-WNM200, in Q3 2014. Meanwhile, Advantech will include the SUSIAccess remote management software tool for IoT in the WSN series. This will enable customers to implement environmental monitoring, urban security and smart street solutions easily and quickly. Advantech and Linear Technology are working together to achieve the ultimate goal of enabling an intelligent planet.
Rise of the Machines: Industrial Machinery Market Growth to Double in 2014
High demand for machines in manufacturing sectors ranging from auto making to packaging will push the industrial machinery market to new heights during the next five years, highlighted by a doubling of growth this year, according to a new report from IHS Technology.
As economic conditions continue to improve worldwide, the demand for machines in sectors such as agriculture, packaging, materials handling and machine tools will push revenues to $1.6 trillion this year, up from $1.5 trillion in 2013. This represents annual growth of 6.3 percent, more than twice the 2.9 percent increase seen in 2013.
Strong growth is forecast to continue for the next four years, with revenue rising to $2.0 trillion by 2018. During this period, the machinery market’s annual growth rate will remain quite impressive, averaging between 5 percent and 6 percent.
Sales growth for industrial machines in 2014 is being driven by a number of factors. First, higher demand for cars worldwide is spurring the requirement for more spending on tools and robotics in the automotive business, as well as the rubber and plastics segments. Meanwhile, an increase in the standard of living and growing spending on nutrition will benefit the food and packaging machinery sectors. Furthermore, rising spending on technology products will boost the demand for robotics, semiconductor equipment, mining, and oil and gas machinery.
At the same time, increased demand for housing, infrastructure and commercial buildings is benefiting the construction equipment sectors. Moreover, social awareness of green technologies is resulting in higher demand for industrial machines in photovoltaics (PV) and in wind turbines.