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Rugged COM Express with Third Generation Intel Core i7 Supports USB 3.0 and PCI Express Gen 3

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A rugged COM Express module is targeted for airborne and vehicle-mounted military computers and human machine interface (HMI) applications required to function in harsh environments. The Express-IBR by Adlink Technology is a COM Express Type 6 module that supports the quad-core and dual-core third generation Intel Core i7 processors and Mobile Intel QM77 Express chipset. Following Adlink’s Rugged By Design methodology, the Express-IBR is suitable for use in environments prone to severe shock, vibration, humidity and extended temperature ranges.

The Express-IBR is powered by a quad- or dual-core third generation Intel Core processor and provides support for USB SuperSpeed 3.0, PCI Express (PCIe) Gen 3, and up to three independent displays. The COM Express module offers up to 16 Gbyte ECC 1333 MHz DDR3 memory in two SODIMM sockets. Three Digital Display Interfaces can be independently configured for DisplayPort, HDMI or DVI. PCIe x16 (Gen3) can serve for external graphics or general purpose PCIe (optionally configured as 2 x8 or 1 x8 + 2 x4); as well as two SATA 6 Gbit/s, two SATA 3 Gbit/s, Gigabit Ethernet and eight USB 2.0 interfaces. The Express-IBR with dual-core processor is validated for reliable performance in extended temperatures ranging from  40° to +85°C and features a 50% thicker printed circuit board (PCB) for high vibration tolerance.

The Express-IBR is a modular, power efficient solution for applications running in space-constrained, extreme rugged environments. It is compatible with the COM Express COM.0 Revision 2.0 Type 6 pinout, which is based on the popular Type 2 pinout, but with legacy functions replaced by Digital Display Interfaces (DDI), additional PCI Express lanes and reserved pins for future technologies. The new Type 6 pinout also supports SuperSpeed USB 3.0 interface, which was unavailable in COM.0 Rev. 1.0.

ADLINK Technology
San Jose, CA.
(408) 360-0200
www.adlinktech.com