Small Form Factor Conduction Cooled Chassis Features Composite Materials

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A new, rugged 6-slot 3U OpenVPX (or 7-slot 3U CompactPCI) conduction-cooled chassis is designed for harsh environments. The SFF-6 Small ATR-style small form factor baseplate conduction-cooled chassis is the newest member of Curtiss-Wright Controls Electronic System’s Hybricon family of advanced military COTS electronic packaging solutions and features the company’s CoolWall thermal technology to support system heat dissipation up to 400W. This ATR-style chassis, fabricated from a proprietary mixture of composite materials and aluminum, speeds and simplifies the integration of high-performance, low-power embedded COTS subsystems designed for use in space, weight and power (SWaP)-constrained environments.

The chassis is fabricated from a proprietary mixture of composites and aluminum. This patent pending CoolWall technology provides significantly higher thermal conductivity than aluminum at lighter weight. It is designed for rugged airborne and ground mobile application environments with extended temperature, shock & vibration tolerance. The chassis comes with a military power supply for MIL-STD-704F aircraft or vehicle use. It supports 6-slot OpenVPX, VPX-REDI 1”pitch backplane and is designed to the latest OpenVPX, VPX and REDI draft specifications. Custom configurations and integration are available.

Curtiss-Wright Controls Electronic Systems, Littleton, MA. (978) 487-282. [].