RTC Magazine

Advances in chip integration—primarily more functions squeezed into smaller CPUs—and plummeting hardware costs have resulted in an expansion of the types and sizes of small form-factor boards used as processor control modules in automation and control. An increasingly wide variety of small modules, often PC-based, with configurable I/O and network interfaces are finding their way into automated devices. The ubiquitous x86-based PC technology is found in a wide range of standard form-factors—including PC/104, ETX, EPIC, COM Express and PMC—as well as a huge number of custom board sizes. But FPGAs are beginning to show up and, at the higher levels of control, DSPs are increasingly used.

The types of devices being automated are changing too, as control has moved outside the industrial context and into the everyday world and these devices are increasingly connected to the Internet. With such a huge range of possible designs, OEMs want as close to a “perfect-fit” solution as possible for each system—in terms of the application, time-to-market and total life-cycle costs—which is one major reason that there are so many small form-factors.

Small Form-Factors Proliferate

Designers are getting more specific about the amounts of electrical power and processing power required for the performance they need as well as application-specific I/O, physical board size, ruggedization and extended temperature operation, according to Bob Burckle, vice president of WinSystems. “Additionally, long-term availability of the hardware and initial engineering design support are key factors evaluated in order to make the decision as to what boards to buy.”

Other fundamental shifts lie behind the rise of multiple small form-factors in networked processor control boards. These include the fact that the cost of small boards is dropping rapidly, and a greater need for automation in applications where it either wasn’t needed before or less was required.

At the low end of the market are very small modules where PLC applications are moving up into the embedded space, says VersaLogic CEO Len Crane. “At some point, you can’t stretch a PLC far enough. Those folks need lower-cost, lower-performance hardware.”

In some classic automation areas programmable automation controllers (PACs) are being substituted for older PLC technology. Inside the PAC is a smaller, low-power, x86 CPU from either Intel or AMD, which can be packed into smaller form-factors, says ADLINK Technology America’s general manager Pei Chien Lee. “So the PAC is a PC inside, but it can connect to DeviceNET and CANbus networks.”

The need for greater automation has helped shift many OEMs toward the “buy” end of the make vs. buy decision spectrum. This shift has already occurred with motherboards for two separate but related reasons: the “buy” option is cheaper at the same time that the “make” option has become more expensive.

Processor modules may not be far behind on this curve, since the economics of make vs. buy has moved toward buying small processor modules that are swapped out to create a next-generation system. “At the board level this is very compelling whether you have large or small volumes,” says Steve Cooper, CEO of One Stop Systems. “The same trend applies in bigger systems, such as those based on CompactPCI Express. Bigger, compact custom systems are also going to standard off-the-shelf modules.”

But the variety of small form-factors, especially those running PC code, may have exceeded the limits of reasonableness. System design engineers want a stable platform with vendor support that will still be there a few years out. “That’s a real problem with all of these formats, except for PC/104,” says Jeff Milrod, CEO of BittWare. “The newest standard isn’t necessarily the best one. I’m going to invest in ‘old’ platforms like VME and PCI because I know they work. New technologies plus new formats equals risk squared. Take one or the other.”

More Connected MeansMore I/O

So how is networking affecting board design? Primarily in the increase in I/O on CPUs. “We’re starting to see more CPUs with more connectivity,” says Jonathan Miller, president of Diamond Systems. “For example, GPS is now being built in, similar to the way Ethernet is now included in all CPUs.”

It’s become incredibly cheap to embed an Ethernet controller in small devices, such as device servers, or even photocopiers and soft drink dispensing machines. Processor modules are coming with a wide variety of industrial I/O, such as CAN, Profibus and Device Net, as well as ZigBee. For example, WinSystems’ LBC-GX500 SBC has a wide variety of wired and wireless connectivity options (Figure 1).

In addition, there is widely available PC-based I/O such as USB, which is replacing many older interfaces. USB’s advantages are similar to those that made ISA popular for so long. “It’s fairly simple, straightforward to use, inexpensive, readily available, familiar to most users and meets the needs of a niche market that doesn’t need the speed of PCI,” says Micro/sys president Susan Wooley. As time goes on, more MCUs will implement USB, and chipsets will have a higher USB port count.

There is also a shift from parallel to serial interfaces for control I/O. “Although very high-speed onboard interfaces by default end up being parallel, such as PCI Express, when you go off-board those that used to be parallel are moving toward serial, for example, from parallel ports to USB and from SCSI to SATA,” says Wooley.

Some simple expansion needs are not served well by a full-sized PC/104 add-on board. The cost of that board, along with the required stacking connectors, can make adding just a few digital or analog channels to a system fairly expensive for an OEM, says Crane. VersaLogic’s SPX expansion format was designed to address these issues (Figure 2).

Software Design Burden Grows

In addition, getting a handle on system performance has become increasingly difficult because a processor’s real speed can be hidden by OS bloat. As a result, customers are specifying two to three times as much performance as they actually need, says John McKown, president of Octagon Systems. “If you’re running an industrial control program under Linux or Windows, you don’t really know what the response time is. Because time-to-market is killing everyone, it’s difficult for customers to find the time to optimize these programs.”

As any system designer knows, software is becoming an increasingly important part of the design burden. In some cases, that design burden can reach 100%, says Miller.

In general, at least 80% of design time is spent on software, since that’s where a system’s value-add lies. Although different products may use the same system hardware components, “it’s how the system is configured plus the application software that is installed that can make it a medical blood analyzer, a bomb sniffer, a red-light camera detection system, oil pipeline controller or even a toll road tag reader,” says Burckle.

Pico-ITX Mainboard Takes on NetworkedTransportation
by Derek Lin and Gaynor de Wit, VIA Technologies

Reliably tracking hundreds or thousands of long-haul delivery trucks is essential for distribution transportation operators. By accessing wideband communication, in-cab computers can record routes driven and provide up-to-the-minute delivery status and cargo information. Likewise, police patrol cars require a reliable in-vehicle computing platform to quickly cross-check data during vehicle inspection or at a crime site.

Although the benefits of in-vehicle computers are clear, the challenges of providing transportation platforms are considerable. In addition to performance and connectivity, low power draw and heat production are essential, as are high reliability and compact size. A ruggedized case is essential to withstand the motion of bumpy or off-road driving, and the ability to build a fanless system with no moving parts is of considerable value.

Addressing these needs, the world’s tiniest full-featured x86 mainboard is aimed at next-generation small footprint embedded computers in networked control applications. Based on the new Pico-ITX form-factor, which is optimized for power efficiency and space savings, VIA Technologies’ EPIA PX mainboard is smaller even than PC/104 at 10 cm x 7.2 cm. It gives system developers a standardized, ultra-compact, highly integrated platform that can be utilized across multiple embedded PC, system and appliance designs.

The VIA EPIA PX is powered by the 1 GHz VIA C7 CPU. Connectivity includes USB, LAN, WLAN and 3G (via USB), as well as ATA or SATA storage and a range of display support including LCD, VGA or LVDS/DVI. Additionally, the VIA PadLock Security Engine is a suite of security tools that, when enabled, offers on-the-fly AES encryption of up to 25 Gbits/s.

Minimal power draw and heat production are essential to in-vehicle platforms (Figure 1). The low power draw and effective heat dissipation of the VIA EPIA PX allows the design of small systems that can be passively cooled, sealed in dustproof chassis and stowed away in 1 DIN dashboards.

The Pico-ITX form-factor’s compactness is made possible by silicon power efficiency, which makes x86-based systems powered by car batteries a feasible design option. Thermal design power (TDP), also known as maximum power use, is only 9 watts for the 1 GHz VIA C7 and 12W for the 1.5 GHz version. Combined with an average operating power of less than 1W for each version, this means that VIA CPUs are more power efficient than current x86 processor rivals. TDPs of the nearest Intel offerings range from 21W to as high as 84W for the Intel Celeron M.

From automotive PCs embedded within dashboards and in-flight entertainment systems to industrial automation systems and portable devices, the Pico-ITX form-factor enables the design of full x86 computing devices in previously impractical locations and applications.

VIA Technologies, Fremont, CA. (510) 683-3300. [www.viatech.com].

Logic Modules Deliver Compact, Flexible, Speedy Solution
by Guy Marom, Advanced Knowledge Associates

Designers of systems used in networked real-time automation and control applications need three things: the ability to get to market simply and cost-effectively, a compact solution, and the ability to upgrade systems as required without major redesign efforts. Moreover, they need to know that their systems will be capable of adapting to and scaling out of component obsolescence issues later in their lifecycles.

A new approach that addresses all three issues centers on smart logic systems-on-module (SOMs). These building blocks are miniaturized, reconfigurable, fully self-contained, high-performance SOMs based on industry-standard programmable logic platforms that include processor cores and all necessary I/O and peripheral circuitry. They are designed to replace complex system elements that are often proprietary and therefore inflexible, bulky, costly, subject to obsolescence issues, inefficient in terms of power consumption and low in performance.

For example, many times whole mother/daughterboard configurations can be replaced by a single board with one SOM. In contrast to other form-factors such as PC/104-based devices, SOMs are smaller and more inherently rugged, and combine all the processing power and operating system elements needed to get a system up and running very quickly.

System-on-module suppliers such as Advanced Knowledge Associates (AKA) remain platform- and technology-agnostic, preferring to choose the most appropriate solution for the task. Technologies include Xilinx or Altera programmable logic chips, ARM or PowerPC MPUs and Linux, VxWorks or other embedded operating systems. Size and parts counts are also reduced. For example, AKA’s modules typically measure 2 in. x 2 in., yet contain over 200 components, including clocks, power, reset circuitry, temperature and passives.

Upgrading a SOM-based system is easy: designers can simply use a faster module with greater functionality. Nor is obsolescence an issue. Although single components frequently become obsolete, SOM makers can ensure continuity of supply by a simple internal redesign, which in most cases will not have an impact on parts qualification.

One SOM well suited to the demands of real-time control and automation systems is AKA’s LM125. Based on a high-density FPGA fabric and employing a Xilinx µBlaze CPU core, it incorporates 256 Mbytes of SDRAM and 512 Mbytes of flash to handle multiple boot images for logic and software applications, while supporting a wide variety of interfaces, including USB, MIL-STD 1553, RS-232, SPI, GPIO and I2C (Figure 1).

The module’s complete software stack includes operating system, industry standard boot-loader and built-in diagnostics for screening and fault tolerance support. One LM125 can be used as the main control subsystem for diverse applications in real-time networked control, such as motion control, protocol bridging, data acquisition and measurement.

The LM125’s modular architecture facilitates the simple integration of user logic and custom peripheral sets. Onboard programmable clock generation, voltage regulation and power monitoring further ease system integration. Because it is based on programmable logic technology from the world’s leading FPGA manufacturer, the Xilinx Spartan IIE, the LM125 enables great system flexibility, as designs can be reprogrammed to include new functionality.

Next-generation SOMs remove the time-consuming task of getting multiple elements such as processors, operating systems, interfaces, peripherals, clocking and power to work together, and are currently providing industry’s most compact and integrated system solutions.

Modular Touchscreen WorkstationsImprove Efficiency, Upgrades
by Dale Szymborski, Kontron Mobile Rugged Division

In many different sizes and configurations, displays are used in industrial applications to help manage production. In some critical factory environments—where equipment is exposed to various elements, temperatures, shock and vibration—they can quickly wear out, requiring frequent replacements or upgrades.

In demanding industrial environments it can be difficult to maintain maximum factory floor uptime when equipment must be replaced often. In many cases, entire systems must be replaced in order to upgrade only one failed component. Beyond the associated material costs there are often additional labor costs, since specialized tools and trained professionals may be required to complete complicated implementations.

To minimize operational downtime, equipment must be maintained as efficiently as possible. System modularity therefore becomes a key feature in this environment. The ideal system replacement would be a modular touchscreen workstation unit with display, workstation and power supply unit (PSU) modules, which operates reliably at elevated temperatures and can be serviced in-plant without the need for specialized tools (Figure 1).

If any element—the display, workstation or PSU—can be assembled and maintained on the floor by factory employees, rather than outsourcing the work to a team of technical professionals, costs can be kept down and uptime maximized. Modularity would also allow the system’s components to be utilized independently—as a touch display only, a computer host only or as a complete workstation—to conserve power and minimize unnecessary wear on equipment. The modular workstation would also feature a small footprint to facilitate incorporation in space-constrained existing housings.

Environmental hazards must also be taken into account, since a system used within a factory may be exposed to high temperatures and required to operate non-stop for long periods of time. The utilization of low-power components would allow the system to generate less heat, thus improving reliability and ultimately the factory’s equipment ROI.

The Kontron Stingray modular workstation is a three-piece system consisting of display, workstation and PSU, which meets all of these criteria. A failed or obsolete component can be easily swapped out, without using tools. The unit’s stainless steel front bezel seal assures protection and survives mandatory factory hose-downs. Custom expander plates let a display fit into non-standard, pre-existing enclosure openings.

Low-wattage displays, highly efficient industrial-grade power supplies and Intel’s LV Pentium M processors reduce heat production. The separation of CPU, power supply and display allows maximum airflow and minimizes trapped heat. Each modular component is contained in its own perforated, aircraft aluminum housing, providing maximum rigidity and optimal heat dissipation.

Kontron America, Poway, CA. (858) 677-0877.
[www.us.kontron.com].

ADLINK Technology America, Irvine, CA. (949) 727-2077. [www.adlinktech.com].

Advanced Knowledge Associates, Santa Clara, CA. (408) 431-0735.
[www.advancedknowledgeassociates.com].

BittWare, Concord, NH. (603) 226-0404. [www.bittware.com].

Diamond Systems, Mountain View, CA.
(650) 810-2500.
[www.diamondsystems.com].

Kontron America, Poway, CA.
(858) 677-0877. [www.us.kontron.com].

Micro/sys, Montrose, CA.
(818) 244-4600. [www.embeddedsys.com].

Octagon Systems, Westminster, CO. (303) 430-1500.
[www.octagonsystems.com].

One Stop Systems, Escondido, CA.
(760) 745-9883.
[www.onestopsystems.com].

VersaLogic, Eugene, OR.
(541) 485-8575. [www.versalogic.com].

VIA Technologies, Fremont, CA.
(510) 683-3300. [www.viatech.com].

WinSystems, Arlington, TX.
(817) 274-7553. [www.winsystems.com].