RTC Magazine

BittWare and CorEdge Networks Partner on MicroTCA, AMC Dev Tools

BittWare has announced a partnership with CorEdge Networks and the release of their RapidTCA Development System, a development environment for Advanced Mezzanine Card (AMC) and MicroTCA designs. To facilitate this partnership, BittWare has entered into a worldwide value added reseller (VAR) agreement for CorEdge Network’s PicoTCA development chassis and backplanes. The RapidTCA Developers System is comprised of CorEdge Network’s two-payload slot, 1U PicoTCA stand-alone test and development system, and BittWare’s DSP21k development software. Customers have the option to also purchase one or both of BittWare’s hybrid signal processing AdvancedMCs.

The RapidTCA Development System provides a development environment by emulating an actual AdvancedMC or MicroTCA system, providing front panel access to all AMCs in the system. The MicroTCA backplane supports two single-wide or one double-wide extended full-height AdvancedMC, and does not require a switching mechanism due to its cross-connected base channel, fabric and extended fabric connectivity. AdvancedMC specifications AMC.0, AMC.1, AMC.2, AMC.3 and AMC.4 are all supported.

A CorEdge Networks System/Power Controller (SPC), which occupies a third slot on the backplane and controls all backplane power, provides quick power up to all AdvancedMCs in a MicroTCA-like environment. The entire system is encased in a 1U-high bench top chassis with clear, removable top and bottom covers for easy probe access to the AdvancedMCs while the system is up and running. The chassis also includes dual front replaceable push/pull integrated air filter, fan, fan trays and an external 100-240 VAC to 48 VDC power supply.

DSP Chip Market Is Forecast to Grow a Moderate 8% in 2007

The market for general-purpose digital signal processor (DSP) chips is forecast to grow 8% in 2007 to the $9 billion level according to a new market study from Forward Concepts. That growth is in contrast to the lackluster overall integrated circuit growth of 3.5% predicted for 2007. The new study, “DSP Chip Strategies ’07” predicts a more typical DSP market growth of 15% in 2008 driven by communications and multimedia applications. But the new study also emphasizes the even bigger embedded DSP market that will grow to $17.6 billion in 2007, to almost twice the size of the general-purpose DSP chip market. The new in-depth study is believed to be the most comprehensive study available of markets driven by DSP technology, and includes the results of a new survey of DSP professionals in over 30 countries.

The embedded DSP market is led by companies like Qualcomm, Broadcom, Marvell and Infineon, with most of their DSP products offered as Systems on Chip (SoC). Because of the heavy SoC emphasis, the major RISC vendors have added DSP capability to their product offerings. The report profiles the DSP market stance of these and over 100 other chip and core vendors. Details of the study and a complete table of contents can be found at: http://www.fwdconcepts.com/DSP07.htm.

PICMG Adds Ethernet Fabric to Advanced Mezzanine Card

PICMG announced that it has released a subsidiary specification for the popular Advanced Mezzanine Card (AMC). PICMG AMC.2 defines the implementation of 1 and 10 Gbit/s Ethernet links on AMC.0 Modules and Carriers. The intended implementation practice will normally include at least one link of Ethernet.

The Advanced Mezzanine Card specification defines modular daughter cards designed to provide extra functionality to AdvancedTCA cards. They can also be used to add functionality to any other “carrier” cards and are used as the “blades” in MicroTCA systems. The base specification (AMC.0) defines the module’s mechanical, interconnect, management, power and thermal requirements. The new AMC.2 specification is limited in scope to defining link usage, management and electronic-keying (E-Keying) parameters for Gigabit Ethernet (GbE) and 10 Gigabit Ethernet (10 GbE) on AMCs and carrier boards. “Ethernet dominates the embedded multi-vendor serial interconnect market,” said Alan Deikman, CTO of ZNYX Networks and chair of the AdvancedMC.2 subcommittee. “It is only logical to extend that to the mezzanine, and we have seen advanced development for AMC.2 already” he added.

AMC.2 will be provided free to PICMG members and is available for purchase by non-members. More information, including product listings, can be found at www.picmg.org. Founded in 1994, PICMG is a consortium of more than 450 companies that collaboratively develop open specifications for high-performance telecommunications and industrial computing applications.

Intel Launches Quad-Core Embedded Processor Line

The Quad-Core Intel Xeon processor 5300 series debuted by Intel at this year’s Embedded Systems Conference is a launch of a four-core series with extended lifecycle support aimed at the embedded segment. So far, the series consists of two members. The new E5335 and E5345 embedded processors bring to 14 the number of quad-core products Intel has brought to market in less than 6 months.

With dual-processing capabilities providing up to eight cores per platform, the Quad-Core Intel Xeon processor 5300 series is available in 2.0 GHz (E5335) and 2.33 GHz (E5345) speeds. These processors are targeted for intense computing and I/O-intensive workloads within high-end communications and enterprise systems, including rackmount (1U/2U) and blade servers, NAS and SAN systems, and medical imaging equipment.

To demonstrate the potential of Quad-Core designs, Intel has presented a product based on two 5300 series processors, the Intel IP Network Server NSC2U. The server enables high I/O throughput and performance capabilities suited for a variety of network-centric applications from security intrusion prevention to telecommunications services-over-IP (SoIP), including IMS, IPTV and Video on Demand (VoD). The NSC2U server features a ruggedized chassis, compact form-factor and extended lifecycle support for the components. Intel also announced a road map (but to date no products) for a family of system-on-chip products consisting of an IA32 processor, a North bridge and a South bridge on a single chip.

RapidIO Trade Association Teams with Embedded Planet to Deliver Design Training

The RapidIO Trade Association and Embedded Planet have announced a partnership arrangement to create a RapidIO Technology training curriculum that will provide hands-on training for designers employing RapidIO technology in high-performance, innovative systems. Embedded Planet will leverage its professional training experience, first-hand knowledge of RapidIO design processes, and input from the RapidIO Trade Association members to develop and deliver a set of high-quality training courses. RapidIO hardware and software training courses are scheduled to be available beginning in April 2007.

“The RapidIO ecosystem continues to grow as OEMs and ODMs discover the powerful benefits of designing with RapidIO technology,” said Tom Cox, executive director of the RapidIO Trade Association. “With this new training curriculum from Embedded Planet, independent testing through RIOLAB, more than a hundred products, and a growing Trade Association community, designers have everything they need to create high-performance systems.”

The training program is designed for engineers designing with Serial RapidIO for the first time as well as for experienced designers seeking to hone their knowledge and keep abreast of RapidIO technology developments. The courses, RapidIO Hardware Design and RapidIO Software Design, are comprehensive two-day sessions, which focus on both the RapidIO 1.3 and the imminent RapidIO 2.0 specifications. The curriculum provides an overview of Serial RapidIO, packet switching, as well as design tips for the logical, transport and physical layers. The program can be combined into an in-depth four-day course. For information visit www.EmbeddedPlanet.com/training/rapidio_training.asp.

Pico-ITX Form-Factor, the World’s Smallest x86 Mainboard

VIA Technologies has developed a new small form-factor for x86 processors. The VT6047 Pico-ITX form-factor reference design is the smallest full-featured x86 mainboard designed for a new world of ultra compact embedded PC systems and appliances.

The Pico-ITX form-factor is another step in miniaturization. The Mini-ITX mainboard, at 17 cm x 17 cm, which recently celebrated its fifth anniversary as an industry standard form-factor with wide market adoption, was followed by the Nano-ITX form-factor at 12 cm x 12 cm, exactly 50% of the size of the Mini-ITX. Now, the Pico-ITX, at 10 cm x 7.2 cm and 50% of the size of the Nano-ITX form-factor, expresses VIA’s “Small is Beautiful” technology design strategy of shrinking the form-factor to drive the x86 platform into ever smaller systems and whole new device categories.

Leveraging VIA’s expertise in miniaturization at the silicon level through major advances in power efficiency, thermal management and feature integration, the VIA VT6047 Pico-ITX mainboard was designed to be powered by one of VIA’s energy-efficient processor platforms, such as the VIA C7 or fanless VIA Eden processor in the 21 mm x 21 mm nanoBGA2 package, combined with feature-rich VIA system media processors to enable the board to pack a performance punch in a tiny, low-heat, low-power package.

More details about the Pico-ITX form-factor and the VIA VT6047 Pico-ITX mainboard reference design may be found in the “VIA Pico-ITX Form-Factor” white paper, available for download from the VIA Web site at: www.via.com.tw/en/initiatives/spearhead/pico-itx/.

Nallatech and Intel Team to Develop FSB FPGA Accelerator Modules and Tools

Nallatech and Intel have signed an agreement to develop socket-based accelerator modules that support the Intel QuickAssist accelerator strategy. Nallatech is working with Intel and Xilinx to develop and deliver FSB FPGA accelerator modules and design tools to the advanced server market during 2007. These products are compatible with Intel’s latest server platforms and utilize Xilinx’s 65nm Virtex-5 FPGA architecture. As part of this relationship, Nallatech will deliver high-level design tools conforming to the Intel QuickAssist Technology Accelerator Abstraction Layer (AAL), enabling support for ANSI C-based third-party tool flows from both existing and new partners.

According to Nallatech, the engagement with Intel brings more than a decade of experience in FPGA computing and matches it with the rapidly increasing demand for accelerated processing capabilities by customers in the advanced server market. The flexibility and performance of FPGAs coupled with high-speed direct access to the server processors allow users to significantly accelerate the performance of computationally intensive algorithms, thus reducing compute time and power consumption.

“Nallatech has extensive experience in building products that utilize FPGAs as accelerators and we are delighted to join with this industry innovator in developing solutions for Intel’s industry-leading acceleration platforms,” said Dr. Dileep Bhandarkar, director of advanced architectures for Intel Corporation. “The combination of Nallatech’s FPGA computing expertise with Intel’s advanced server platforms, together with our shared cross market application knowledge, will create a powerful solution for addressing the most demanding computing problems.” www.nallatech.com.

PICMG Hosts Technologies Showcase at NXTcomm07

PICMG will again be hosting a technology showcase booth at NXTcomm07, to be held at McCormick Place in Chicago on June 19-21, 2007. The PICMG Technologies Showcase booth, which will be even larger than last year’s, will contain member companies’ exhibits and products that are based on one or more of the popular PICMG specifications. Anyone considering building or using telecom infrastructure equipment based on open hardware specifications should visit the companies in the PICMG Technologies Showcase.

PICMG specifications cover a range of open hardware implementations and include AdvancedTCA, AdvancedMC, MicroTCA, CompactPCI, CompactPCI Express, COM Express and SHB Express. The PICMG Technologies Showcase will showcase the latest COTS building blocks and platforms that are being built on PICMG specifications.

To see which companies are exhibiting at the PICMG Technologies showcase, go to www.picmg.org and click on “News and Events.” The PICMG Web site also includes a product directory where manufacturers list their PICMG-compliant product offerings. Founded in 1994, PICMG is a consortium of more than 450 companies that collaboratively develop open specifications for high-performance telecommunications and industrial computing applications.