A new cooling system for the COM Express specification is based on cooling pipes, which are integrated in the standardized heat spreader. Introduced by congatec, this solution makes it possible to cool next generation high-performance processors with a power dissipation of well over 35W TDP.
“The real problem lies with hot spots around the processor and chipset,” states congatec Product Manager Martin Danzer. “Our improved cooling concept results in a lower processor temperature, which is essential for a more frequent activation of Turbo Boost 2 Technology to ensure maximum COM performance and energy efficiency. As a result, the processor can operate at higher levels than the maximum permitted thermal design power (TDP).” The advantages at a glance:
• Fast spot cooling for full performance
• Elimination of gap filler layer
• Elimination of mechanical stress leads to higher quality
• Better cooling extends the life span of the module
• Heat pipe principle enables innovative customer-specific cooling concept
The new heat pipe cooling design is available in different variants comprising a passive, active and customer-specific solution that creates space for innovative ideas. For example, the heat pipe can be designed in such a way that it can be connected to a customer-specific heat sink. Fanless designs are possible provided the casing is equipped with appropriately sized cooling fins. Ultimately, the design depends on the specific application. The key features of the concept are equally applicable to other electronic circuits.
The new cooling solution is also appropriate for systems with low power dissipation. The modules have a higher thermal reserve, which increases their life span and reliability. Average temperature reductions of only 5 Kelvin can double the statistical life span—a convincing argument when considering the total cost over the lifetime of a system.
San Diego, CA
© 2009 RTC Group, Inc., 905 Calle Amanecer, Suite 250, San Clemente, CA 92673